Femtosecond laser-based Time-Domain Thermoreflectance (TDTR) is one of the most advanced thermal characterization techniques for micro- and nanoscale materials. The TDTR system independently developed by CSMH enables the measurement of key thermal properties, including thermal conductivity, thermal diffusivity, interfacial thermal resistance, and thermal boundary conductance, for materials such as diamond, semiconductors, and metals.The system supports measurements of both bulk samples and thin-film structures with thicknesses ranging from tens of nanometers to several micrometers. It employs a non-contact measurement approach and can operate under ambient conditions or perform measurements through optical windows in a vacuum chamber.
Submit requirements and contact us
Non-contact and Non-destructive Measurement
UItrafast Temporal Resolution
Wide Range of Material Compatibility
Multi-scale Sample Compatibility
The TDTR technique employs a pump-probe measurement scheme, in which a pulsedlaser is used for transient heating and a time-delayed probe laser is used to monitor thethermoreflectance response.
Pump Pulse Heating→Delayed Probe Pulse Detection→Thermal Model Fitting and Data Analysis
The measured thermoreflectance decay curve is analyzed and fitted using a heat diffusion model.Through model-based data fitting, key thermal properties of the sample, including thermal conductivity,thermal diffusiviy, heat capacity, and interfacial thermal resistance (or thermal boundary conductance),can be extracted.
Product Specifications
Thermal Conductivity Measurement Range：1-2500 W/(m.K)
Applicable Thin Film Thickness：10 nm to several micrometers
Thermal Diffusivity Measurement Range：0.1-1000 mm²/s
Temporal Resolution：1 ps
Operating Temperature Range：80 K-450 K
Measurement Mode：Non-contact measurement under ambient or vacuum conditions
Compatible Materials：Si, SiC, GaN, diamond, Ga₂O₃, AlN, AuSn, and other semiconductor and metallic thin-film materials
Advanced Capability：Quantitative characterization of thermal transport across heterogeneous interfaces
application area
MORE
闽ICP备2021005558号-1Leave A Message
