​CSMH Showcases Its Comprehensive Diamond Product Portfolio at CIOE 2026, Highlighting Strong Technical and Manufac

From September 9 to 11, 2026, the 27th China International Optoelectronic Exposition (CIOE 2026) was held at the Shenzhen World Exhibition & Convention Center. Held concurrently with IC Innovation Expo and elexcon, the three exhibitions brought together more than 5,000 exhibitors from around the world to explore emerging trends in the integration of AI and optoelectronics.

As a leading diamond materials company, CSMH made a strong appearance with its comprehensive portfolio of diamond products and solutions. With one of the most extensive product portfolios and broadest application coverage among domestic suppliers of diamond functional materials, CSMH demonstrated the evolving role of diamond from a traditional “industrial material” to a potential core material for AI and next-generation semiconductor technologies.

1. Comprehensive Diamond Product Portfolio on Display

Laser Applications | Diamond Heat Sink + Diamond Windows

With the increasing demand for thermal management in red, blue, and green laser chips, as well as mid- and far-infrared lasers, the application of diamond thermal management materials is becoming increasingly important.

CSMH was among the early companies in China to develop and invest in Diamond Heat Sink technologies. After years of dedicated development, the company has accumulated extensive process expertise and application data. Its Diamond Heat Sink products have undergone long-term customer validation across a range of applications, including red, blue, and green laser chips and mid- to far-infrared lasers. The products have been comprehensively evaluated for reliability, consistency, and long-term stability, demonstrating mature and stable manufacturing processes and supporting volume production and supply for laser chip customers.

In addition, diamond windows offer excellent spectral transmission from X-ray to terahertz wavelengths, together with extremely high thermal conductivity and a low coefficient of thermal expansion, making them critical optical components for demanding high-power radiation environments.

CSMH diamond windows have been successfully applied in major national projects and advanced facilities, including synchrotron radiation, nuclear fusion, and semiconductor process equipment. The company has established end-to-end process capabilities covering diamond material growth, optical coating, metallization, and diamond window brazing.

With their outstanding performance and reliability under extreme operating conditions, CSMH diamond windows provide critical material support for the reliable operation of high-power laser systems, semiconductor equipment, and other demanding applications.

Optical Module Applications | Diamond Heat Sink + Composite Materials

As AI data centers continue to drive higher power densities in optical modules, thermal management of optical chips has become a critical factor affecting output power, operating temperature, and service life.

For optical communications applications, CSMH showcased its Diamond Heat Sink products and diamond-based composite materials, including diamond-copper, diamond-silver, and diamond-aluminum composites.

The Diamond Heat Sink can be configured with an AuSn solder layer to enable highly reliable connections with optical chips. The diamond-copper, diamond-silver, and diamond-aluminum composite product series offer thermal conductivity of 600–1,000 W/(m·K), with a tunable coefficient of thermal expansion ranging from 5–10 × 10⁻⁶/K, enabling adaptation to the thermal management requirements of optical module chips, packages, and other components.

AI Chip Applications | Diamond on Si

For AI chip thermal management, CSMH showcased its proprietary Diamond on Si thermal management solution.

Based on heterogeneous integration and bonding between diamond and silicon, the technology transforms the conventional diamond–silicon heterogeneous bonding interface into a silicon–silicon homogenous bonding interface, enabling compatibility with established advanced packaging processes. This allows downstream manufacturers to introduce the technology without major modifications to existing production lines.

As a Diamond on Si thermal management technology designed for scalable manufacturing, the solution provides a practical pathway for thermal management in advanced packaging of high-power AI chips, supporting the continued evolution of high-performance computing architectures.

Automotive Power Module Applications | Diamond AMB + Diamond-Copper Composites

As new energy vehicles move toward higher-voltage platforms and greater power density, automotive thermal management faces increasingly demanding performance and reliability requirements.

CSMH focuses on diamond AMB substrates and diamond-copper composites, leveraging their high thermal conductivity, CTE compatibility with SiC, and reliable interfacial bonding to reduce junction temperatures in IGBT and SiC power modules, while supporting higher power density and improved reliability.

These solutions can be applied across thermal management scenarios involving batteries, electric drive systems, and power electronics. With stable mass-production and supply capabilities for large-area diamond materials, CSMH is positioned to support the automotive industry’s transition toward higher power density and reliability.

Semiconductor Applications | Single-Crystal Diamond + Doped Diamond

At the exhibition, CSMH also presented its vision for diamond as an “ultimate semiconductor material,” showcasing advanced products including high-quality single-crystal diamond, p-type and n-type doped diamond, and Diamond on SiC.

These technologies demonstrate a broader development path for diamond—from a thermal management material toward a potential core semiconductor material. Covering applications from thermal management to electronic devices, and from substrate materials to heterogeneous integration, CSMH is developing a full technology portfolio aimed at expanding diamond from an auxiliary thermal material into next-generation semiconductor applications.

2. CSMH’s Core Competitive Strengths

01 | Scalable Mass-Production Capabilities

CSMH has established a large-scale intelligent diamond manufacturing facility in Hohhot, Inner Mongolia, with a modern production site covering approximately 10,000 square meters. The company has achieved mass production of 8-inch diamond wafers, with key technical performance reaching internationally advanced levels.

From laboratory development to large-scale production, and from technology breakthroughs to volume delivery, CSMH is building its industrialization capabilities through robust capacity planning and stable manufacturing processes, providing global customers with reliable and scalable diamond material supply.

02 | Globally Oriented Intellectual Property Portfolio

CSMH has proactively established an intellectual property portfolio covering key products and strategic markets in both China and overseas markets. Its patent portfolio spans the entire technology chain, including proprietary equipment development, diamond material fabrication, composite substrate processing, and chip/device integration.

Beyond building intellectual property barriers, CSMH continuously advances manufacturing processes and engineering capabilities. Through the development of dedicated production equipment and iterative process optimization, the company is addressing key technical challenges such as large-area diamond film growth and enabling independent innovation across the material-to-device technology chain.

03 | Comprehensive System-Level Solution Capabilities

CSMH focuses on three core technology areas: thermal, optical, and semiconductor applications, establishing a comprehensive portfolio of products and technologies.

In thermal management, CSMH has developed three differentiated technology pathways: diamond-copper composites for system-level thermal management, Diamond Heat Sink products for near-chip thermal management, and Diamond on Si for advanced packaging integration.

Across thermal, optical, and semiconductor applications, CSMH provides end-to-end services spanning material supply, customized processing, coating, laser processing, and quality inspection. Its integrated “materials–testing–applications” technology system supports customized solutions covering metallization, bonding, and application-specific engineering, enabling customers to access integrated solutions from materials to devices.

During CIOE 2026, experts, academics, industry customers, and international visitors from Japan, South Korea, Germany, the United States, and other markets gathered at the CSMH booth to explore the expanding application potential of diamond materials.

From an early industry participant to an increasingly influential technology and solution provider, CSMH continues to advance diamond materials toward a broader range of high-performance and potentially transformative applications, contributing to the next stage of innovation in AI computing, lasers, optical communications, power electronics, and semiconductor technologies.