CSMH Launches Volume Supply of the World’s First Diamond on Si Heat Sink Composite Substrate

Recently, CSMH’s globally pioneering, self-developed Diamond on Si thermal management technology passed GPU/CPU chip packaging and testing validation by an overseas strategic partner. The results demonstrated a significant improvement in heat dissipation performance and a substantial reduction in chip junction temperature. CSMH plans to officially enter the volume supply stage in the second half of 2026.

△ Product photos

△ Patent numbers from China and the United States, etc.

Since 2024, CSMH has worked jointly with domestic and international chip design companies and leading industry partners on the development of this technology, completing validation from laboratory samples to small-batch product applications. On this basis, CSMH has taken the lead in building a forward-looking invention patent portfolio in key markets including China and the United States. The company has now established full-chain industrialization capabilities covering material preparation, processing, and device integration.

△ Thermal simulation results of diamond heat dissipation solution—chip junction temperature reduced by approximately 24°C, with significant suppression of temperature rise in high power density hotspots.

To address the challenges associated with the growth and processing of large-size diamond thin-film materials, CSMH has developed proprietary equipment and optimized production processes, successfully producing ultra-large-size Diamond on Si films. Through a unique interface design and seed crystal material system, the company has developed core materials with controllable film-thickness uniformity and adjustable interfacial thermal resistance.

Large-size Diamond on Si wafers can be bonded in various forms with Si-based epitaxial wafers used in mainstream semiconductor GPU and CPU chips. For 2.5D and 3D packaging architectures, the size and thickness of the diamond/silicon structure can be adjusted, while its physical properties and coefficient of thermal expansion are compatible with silicon-based chips. This helps effectively mitigate thermal coupling between stacked chips and provides an efficient, reliable, and scalable thermal management solution for advanced packaging.

To support volume production, CSMH has built a modern factory integrating digitalized operations and smart manufacturing. The company has established a full-process capability chain covering customized dedicated equipment, precision grinding and polishing, and high-power laser cutting. In silicon device manufacturing, this technology innovatively transforms diamond-Si bonding into Si-Si direct bonding, significantly reducing bonding complexity, creating efficient thermal dissipation pathways, substantially lowering chip junction temperature, and greatly improving overall heat dissipation performance.

△ Composite Diamond Heat Dissipation Technology Solution

At present, CSMH is working with enterprise customers in high-heat-flux-density application scenarios, including high-performance computing, AI chips, and data centers, both in China and overseas, to promote large-scale application and accelerate volume delivery.

Looking ahead, CSMH will continue to leverage its proprietary intellectual property system and deepen strategic cooperation with downstream customers in joint R&D, volume introduction, and iterative product upgrades. The company aims to promote the deployment of diamond thermal management technology in more high-power application scenarios and accelerate the industrialization of diamond-based thermal solutions.