Exhibition Preview | CSMH Full-Matrix Diamond Thermal Solutions to Showcase at WAIC 2026

From July 17 to 20, 2026, the World Artificial Intelligence Conference & High-Level Meeting on Global Governance of Artificial Intelligence (WAIC), the world’s top AI summit, will grandly kick off in Shanghai. As China’s highest-standard and most influential global benchmark event for the AI industry, this exhibition centers on supercomputing and AI chip thermal management, AI agents, embodied intelligence, industrial implementation, cutting-edge academic research, and the full industrial chain innovation and application of global AI governance.

Invited by Shanghai State-owned Capital Investment Co., Ltd. (hereinafter referred to as Shanghai State-owned Capital), CSMH will make a prominent appearance. Targeting core pain points of the high-computing-power AI industry, the company will display its full-matrix core diamond thermal products and one-stop thermal management solutions. Amid rapid iteration of AI computing power where heat dissipation has become the bottleneck restricting industrial performance, CSMH will fully demonstrate the disruptive application value of diamond materials for AI computing scenarios.

Diamond Full-Matrix Solutions to Resolve AI Computing Heat Dissipation Bottlenecks

At this exhibition, CSMH will systematically display innovative applications of diamond materials in cutting-edge sectors including AI computing power, smart terminals and high-end equipment, and deliver systematic solutions to core challenges facing today’s intelligent industry.

01 Diamond on Si – Erase Thermal Distress in Advanced Packaging

For the first time at this exhibition, CSMH will showcase its diamond on Si heat dissipation solution with complete independent intellectual property rights, supported by a portfolio of patents filed domestically and worldwide. This solution directly grows high-thermal-conductivity diamond layers on single-crystal silicon substrates followed by silicon thinning treatment. While leveraging diamond’s ultra-high thermal conductivity, it features seamless compatibility with existing silicon wafer fabrication processes, fundamentally addressing heat dissipation challenges of GPUs and AI chips.

02 Diamond Composite Materials – "Thermal Conductivity Booster" for Liquid Cooling Systems

To meet high-power computing demands of AI servers and large-scale data centers, CSMH presents diamond composite materials (Cu-diamond) with thermal conductivity ranging from 600 to 1000 W/(m·K). The product portfolio covers heat sink fins integrated with liquid cold plates, chip carriers and package lids, matching diverse thermal management schemes for high-end computing hardware.

03 Diamond Heat Sink – Cooling Base for High-Power AI Chips

Designed for CPUs, GPUs and AI chips, diamond heat sinks deliver thermal conductivity of 1000–2200 W/(m·K). Serving as a proximal thermal dissipation layer, it directly contacts core chip heat sources and dissipates semiconductor-generated heat at ultra-high speeds to drastically lower junction temperature. CSMH provides customized processing services including cutting, drilling, metallization and patterning, delivering comprehensive alternatives to conventional ceramic and metal heat sinks.

04 Diamond Flexible Film – Flexible Thermal Pad for Advanced Packaging

CSMH independently developed free-standing Diamond flexible film with thickness under 25 μm. The films feature uniform thickness, ultra-smooth flat surfaces, and combine ultra-high thermal conductivity with thin, flexible properties. Custom laser cutting and dimensional specifications are available, making the product widely applicable to precision heat dissipation scenarios such as AI server GPUs, HBM stacking, advanced chip packaging, and VR/AR terminals.

05 Diamond Window – Empower Next-Generation AI Optical Systems

Diamond boasts core merits including ultra-wide-spectrum light transmittance, superior wear resistance, high thermal conductivity and chemical stability. Processed into optical lenses and diamond windows as core optical components for AI glasses, it maintains long-term scratch-free optical transmission and resolves drawbacks of traditional silicon carbide components such as high optical loss and easy surface abrasion.

06 Single Crystal Diamond – Build "Ultimate Semiconductor" for Next-Generation AI Computing

Featuring an ultra-wide bandgap, high breakdown electric field and ultra-high thermal conductivity, diamond outperforms silicon carbide and gallium nitride across all comprehensive performance metrics, earning it the title of "ultimate semiconductor material". CSMH supplies thermal-grade, optical-grade and electronic-grade single crystal diamond, alongside boron (B) and nitrogen (N) doped single crystal substrates. The core materials support semiconductor device R&D and drive the AI industry to evolve from a heat dissipation revolution to a full semiconductor revolution.

CSMH consistently ramps up investment in cutting-edge R&D and proactively builds a global patent protection system to spearhead innovations of next-generation diamond and advanced materials. The firm has established a closed-loop industrial chain covering diamond material preparation, precision processing and end-product application, forming distinctive and robust core competitive moats.

CSMH collaborates with global upstream and downstream ecosystem partners to continuously explore and expand diversified application scenarios for high-end computing power. Supported by high-performance diamond base materials, the company consolidates the hardware foundation of computing power, injecting robust core momentum into the leap-forward upgrade of the global AI computing industry and prosperous development of next-generation intelligent technologies.

From July 17 to 20, Booth H4-150, Hall H, B2 Floor, Shanghai World Expo Exhibition & Convention Center, CSMH together with Shanghai State-owned Capital look forward to exploring the material future of thermal management for computing power with global partners across the industrial chain.