Meet CSMH at CIOE 2026
We are pleased to participate in CIOE 2026 in Shenzhen and look forward to connecting with companies, researchers, and technology experts from across the global photonics and semiconductor industries.
From chip-level thermal management to system-level cooling, CSMH provides a comprehensive portfolio of diamond material solutions. At CIOE 2026, we will showcase Diamond Heat Sink, Diamond on Si, Diamond Copper Composite, Optical-grade Diamond Window, and Single Crystal Diamond materials, covering thermal, optical, and semiconductor applications. These solutions are already being applied across a wide range of high-power and advanced technology applications, including lasers, optical communications, AI computing chips, and power semiconductors etc, supporting the evolving requirements for higher power density, improved thermal performance, and long-term device reliability.
For more information about our diamond material solutions and application technologies, please contact us at globalsales@csmh-semi.com or visit our website.
Time：September 9–11, 2026
Address：Shenzhen World Exhibition & Convention Center
Booth No. Hall 4 | Booth 4D205
We look forward to meeting you at CIOE 2026 and exploring new opportunities for diamond materials in next-generation photonics and semiconductor applications.
闽ICP备2021005558号-1Leave A Message
