The application of diamond semiconductors will go further

Diamond is likely to replace some special materials such as silicon carbide and gallium
nitride in semiconductor applications for military and aerospace. Operation in
high-temperature, high-power environments is a basic requirement for new materials
that extend the performance of silicon. Also new applications for diamond CMOS in the
much larger automotive sector, with its own demands for operation in hot, high-power
applications.

Everything that you’ve seen in silicon carbide and gallium nitride markets can easily
be a segment of diamond,Those materials are not so entrenched at this point that they
would be massively disruptive to the market.

Diamond is a direct competitor to silicon carbide. Instead of the 200°C (392°F) upper
limit of silicon carbide, diamond heat sink can operate above 500°C without degradation.

Akhan has been making 200-mm diamond wafers since 2014 for customers such as
Lockheed Martin and Honeywell. Akhan’s shift to 300-mm wafers was as necessary
step to meet demand for a wider range of devices.

Many of the same challenges faced in mil-aero applications such as high temperatures
apply to the automotive sector, where the overall thermal budget for engines must be
reduced. Its shift to 300 mm will make diamond compatible with existing processes and
fab lines while lowering per-unit cost to a point that is competitive—even with
silicon—as soon as 2024.

Since we’re doing a very thin layer of diamond, we’ve previously used a metric that
is per-unit area or pound-for-pound cheaper than gallium nitride. It’s now cheaper
than silicon carbide as well.

The only material that it is not cheaper is silicon, The economies of scale are so massive
that, of course, diamond is still more costly than silicon. With adoption, we want to
approach those price points, that diamond should be cheaper than silicon, not only in
terms of performance per unit area, but also performance savings.

We’ll be doing less mask layers. We’ll have less dense circuitry, which will accomplish
greater functionality for the cost. The system cost should actually come into parity with
silicon.

Our existing products and services such as wafer-level diamond/diamond heat sink/diamond coating can provide professional diamond thermal management solutions
for various fields. Welcome to discuss in detail!