How Diamond Heat Sink Helps Dissipate Heat from Automotive Electronic Devices

The application of diamond heat sinking in automotive electronic equipment cooling is receiving more and more attention, especially in the context of the rapid development of electric vehicles and smart car technologies. Modern automotive electronic devices, such as battery management systems, power control units (PCUs), autopilot sensors, and high-performance computing units, usually generate a large amount of heat, which, if not dissipated in a timely manner, will seriously affect their performance and reliability. The introduction of diamond heat sinks not only improves the efficiency of thermal management, but also reduces the complexity and cost of the entire cooling system and improves the overall performance of the vehicle.

In addition, in autonomous driving technology, thermal management of sensors and high-performance computing units is also critical. Diamond heat sinks ensure that these critical components maintain optimal operating temperatures under a variety of environmental conditions, thereby improving system responsiveness and reliability.

CSMH uses the MPCVD method to prepare large-sized and high-quality diamonds, and currently has mature products such as diamond heat sinks, diamond wafers, diamond windows, diamond hetero junction integrated composite substrates, etc. Among them, the thermal conductivity of diamond heat sinks is 1000-2200W/(m.k), and the surface roughness of diamond wafer Ra<1nm. lt has been applied in aerospace, high-power semiconductor lasers, optical communication, chip heat dissipation, nuclear fusion and other fields.