In the field of new energy vehicle heat dissipation, AMB (Active Metal Brazing) is a key packaging technology, an advanced process used to manufacture high-performance ceramic copper-clad substrates. This substrate serves as the "skeleton" and "blood vessels" of high-power modules in electric vehicles and photovoltaic power generation, responsible for carrying the chip and rapidly dissipating heat.
CSMH's diamond AMB products fully leverage diamond's ultra-high thermal conductivity while integrating it into power modules through the highly reliable AMB process, enabling the application of diamond materials in key areas such as IGBTs in new energy vehicles.
Diamond AMB directly increases thermal conductivity by an order of magnitude, significantly reducing chip junction temperature and greatly improving module power density and reliability. Diamond's coefficient of thermal expansion matches that of semiconductor chips (such as SiC), reducing thermal stress and extending lifespan. The AMB process provides strong interfacial bonding, ensuring stable operation of diamond in automotive-grade environments with high vibration and large temperature differences.
CSMH offers comprehensive diamond heat dissipation solutions, including high thermal conductivity diamond heat sinks, wafer-grade diamond, and diamond-copper composite materials, providing efficient thermal management solutions for high-power chips. Through optimized metallization processes, precision cutting technology, and customized drilling services, we achieve a perfect match between heat dissipation performance and structural design, helping high-frequency, high-power, and high-temperature applications overcome heat dissipation bottlenecks and improve chip heat dissipation efficiency and reliability.
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