New Technology, New Choice: Diamond Heat Sink Plates Unlocking Multi-Scenario Thermal Management Applications

Diamond heat sink plates are key components for heat dissipation of high-power electronic devices, leveraging the ultra-high thermal conductivity and thermal stability of diamond materials. Endowed with multiple core advantages including superior thermal conductivity, radiation resistance, electrical insulation and chemical stability, they act as efficient "heat transporters" in thermal management, rapidly conducting heat away to prevent overheating and damage to materials. Different types of diamond heat sink plates also have their respective advantages in specific application fields.

Single-crystal Diamond Heat Sink Plates

(1) High-power Semiconductor Laser Scenario

High-power semiconductor lasers feature high electro-optical efficiency, easy modulation, small size and light weight. The packaging of high-power semiconductor lasers imposes two primary requirements on transition heat sinks: low thermal resistance and low thermal mismatch.

We provide an integrated solution of "single-crystal diamond heat sink + optical components", namely adopting customized CVD single-crystal diamond heat sink plates to match the thermal expansion coefficient of chips.

(2) High-end Electronic Device Scenario

Focusing on the core technological demands of high-end electronic devices such as quantum computing and high-end sensors, we offer full-process technical implementation support. The core technology application is centered on **material customization + process adaptation + full-life cycle guarantee**, and we provide a complete range of technical support from sample customization and technical debugging to mass production delivery. We assist customers in device integration and performance optimization, unblocking the entire industrial chain of technological implementation.

Polycrystalline Diamond Heat Sink Plates

5G/6G RF Device Scenario

We adopt a 6-inch wafer-level diamond substrate bonding solution. Through precise bonding technology, we achieve efficient integration of GaN wafers with diamond substrates, improving the heat dissipation efficiency and power handling capacity of RF devices, and solving the problems of poor heat dissipation and high energy consumption of traditional substrates. Meanwhile, we provide standardized wafer products that are adaptable to customers' mass production lines, and customize wafer thickness and surface roughness according to the requirements of base station devices, helping customers quickly realize mass production and commercialization.

In the future, research on the multi-form application of diamond heat sink plates will continue to evolve and innovate, injecting new impetus into the advancement of China's high-end industries. Compound Semiconduclor (Xiamen) Technology Co., Ltd., a national high-tech enterprise specialized in the R&D, production and sales of wide bandgap semiconductor materials, adheres to the philosophy of "large size, low cost, high quality and is committed to providing comprehensive diamond heat sink solutions for customers at home and abroad.