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Home KnowledgeTechnologyDiamond Microchannel Heat Sink Designs For High Heat Flux Thermal ControlDirected energy weapons, wide band gap semiconductor based radars, and other powerful systems present significant thermal control challenges to component designers. heat Flux levels approaching 2000 W/cm are encountered at the base of laser diodes, and levels as high as 500 WI /cm are expected in laser slabs and power amplifier tube collectors. These impressive heat flux levels frequently combine with strict operating temperature requirements to further compound the thermal control problem. Many investigators have suggested the use of diamond heat spreaders to reduce flux levels at or near to its source, and some have suggested that diamond microchannel heat sinks ultimately may play a significant role in the solution of these problems. Design engineers at Raytheon Company have investigated the application of all-diamond microchannel heat sinks to representative high heat flux problems and have found the approach promising. Diamond microchannel fabrication feasibility has been demonstrated; integration into packaging systems and the accompanying material compatibility issues have been addressed; and thermal and hydrodynamic performance predictions have been made for selected, possible applications. An example of a practical, all diamond microchannel heat sink has been fabricated, and another is in process and will be performance tested. The heat sink assembly is made entirely of optical quality, CVD diamond and is of sufficient strength to withstand the thermal and pressure-induced mechanical loads associated with manufacture and use in tactical weapons environment,many of the areas for future study.
We focus on the research and development and production of diamonds, and have been technologically precipitated for more than ten years. Currently, diamond heat sink, wafer-level diamonds, diamond metallization, diamond coatings (GaN), etc. Regarding heat dissipation solutions for high-power devices, we provide a comprehensive solution for new diamond heat dissipation materials.
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