Diamond polycrystalline is a material composed of many tiny diamond crystals, which not only retains the advantages of high thermal conductivity, high strength and good chemical stability of diamond, but at the same time overcomes the problems of high cost and difficult processing of single crystal diamond. At present, the preparation methods of diamond polycrystal mainly include chemical vapour deposition (CVD), high temperature and high pressure (HPHT) synthesis and plasma chemical vapour deposition. Each of these methods has its own characteristics, and together they are committed to developing diamond polycrystalline materials with high thermal conductivity, low cost and easy processing.
Heat dissipation advantages of diamond polycrystalline
①High Thermal Conductivity
The thermal conductivity of diamond polycrystalline is much higher than that of traditional heat dissipation materials such as copper and aluminium. Its thermal conductivity ranges from 1000-2000W/m-K, while that of copper is only 385W/m-K and that of aluminium is 237W/m-K. This gives diamond polycrystalline a significant advantage in the field of heat dissipation.
②Good mechanical properties
Diamond polycrystalline has high hardness and abrasion resistance, which is suitable for heat dissipation needs in extreme environments and ensures that the equipment can still operate stably under harsh conditions.
③Chemical stability
Diamond polycrystalline is not easy to react with other substances, applicable to a variety of environments, to ensure the lasting stability of the heat dissipation effect.
④Easy processing
Diamond polycrystalline can be processed into different shapes and sizes through cutting and grinding to meet different heat dissipation needs.
Practical application cases
①Advanced Packaging Technology
A domestic team has successfully integrated a polycrystalline diamond substrate into the backside of a 2.5D glass adapter plate encapsulated chip. This technology significantly reduces the highest junction temperature of the chip and the thermal resistance of the package, demonstrating the great potential of diamond polycrystalline in advanced packaging technology.
②Semiconductor Laser
Diamond heat sinks are used in semiconductor lasers to significantly improve heat dissipation efficiency. For example, high quality diamond heat sinks prepared by CSMH using advanced MPCVD technology have achieved significant cooling effect and power enhancement in semiconductor lasers.
③5G Communication Field
In the field of 5G communications, diamond heat sinks provide excellent heat dissipation for high-frequency, high-power RF devices, enhancing system reliability. In addition, diamond materials are also used in the field of new energy vehicles to extend battery life and improve safety by reducing thermal runaway phenomenon.
④High Power Devices
Diamond materials are known as the fourth generation of heat dissipation materials, and play an important role in the heat dissipation of high-power electronic devices, semiconductor chips and other key devices.
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