Diamond wafers demonstrate superior performance in chip aging test machines

Chip aging test is one of the important means to improve chip reliability. Through aging test, problems and defects of chips under various environmental conditions can be exposed, and these problems can be repaired and improved, thereby improving reliability and service life.

In aging test, temperature plays a crucial role. If heat dissipation technology is not done well, it will directly affect device performance, lead to a decrease in lifespan and reliability, and even damage the chip. The ultra-high thermal conductivity of diamond will play an important role in aging equipment.

Diamond wafer has excellent properties such as wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. It is currently one of the most promising semiconductor materials, and its classic application scenario is in the field of thermal management. By utilizing the high thermal conductivity of diamond, the temperature thermal equilibrium time during the testing process can be shortened, and the efficiency of aging test can be improved.

Soldering the diamond wafer onto the copper base of the chip aging test machine can greatly improve the heat dissipation capacity and wear resistance of the copper base. The chip can be directly placed on the surface of the diamond wafer on the copper base to meet the needs of high-power chip aging test, avoiding the use of soft solder melting or anti sticking causing chip scrap.

The data shows that when using the diamond+copper base scheme, the chip test current is still on the rise at 40A, while when using only copper, the current is at 30A. Due to heat dissipation issues, the power reverses and cannot meet the test requirements.

CSMH focuses on the production and research of diamond materials, mastering internationally leading diamond production processes, and possessing mature product systems and thermal management solutions. Among them, the surface roughness of diamond wafers is Ra<1nm, and the thermal conductivity of diamond heat sinks reaches 1000-2000W/(M.K). It can provide customized services, including diamond wafers, diamond heat sinks, diamond windows, and diamond heterojunction integrated composite substrates.