Chip aging test is the application of stress to the chip, accelerating the exposure of potential faults in early failed chips, and removing defective chips through testing to ensure that qualified chips have high reliability. In actual production, there are some factors that affect the reliability of aging testing, and the goal is to reduce their interference with aging testing and ensure the accuracy and reliability of measurement results.
To better ensure temperature stability:
On the one hand, it is necessary to improve the thermal conductivity of the fixture base and its contact with the chip, so that the temperature of the heating table can be quickly transmitted to the chip; On the other hand, it is necessary to reduce opportunities for contact with the external environment and avoid heat exchange with the external environment.
Diamond has excellent properties such as wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. It is currently one of the most promising semiconductor materials, and its classic application scenario is in the field of thermal management. By utilizing the high thermal conductivity of diamond, the temperature thermal equilibrium time during the testing process can be shortened, and the efficiency of aging testing can be improved.
CSMH focuses on the production and research of diamond materials, and innovatively applies diamond heat sink to chip aging test equipment, greatly improving temperature stability during the aging test process. We can provide professional customized products and services, including diamond wafers, diamond heat sink(metallization),diamond+copper seats, etc.
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