Diamond wafer - the ultimate high-efficiency heat dissipation weapon for new energy vehicle IGBT

IGBT is the core component of the drive motor for new energy vehicles, which plays a dominant role in the efficiency, power density, and reliability of automotive electric drive. Temperature characteristics are an important indicator for the design and reliability evaluation of IGBT module products. To significantly improve their power density, heat dissipation performance, and long-term reliability, an efficient heat dissipation scheme is particularly important.

IGBT (Insulated Gate Bipolar Transistor), also known as Insulated Gate Bipolar Transistor, is a composite fully controlled voltage driven power semiconductor device composed of BJT (Bipolar Crystal Transistor) and MOS (Insulated Gate Field Effect Transistor), which has the characteristic of self turning off. For electric vehicles, IGBT directly controls the conversion of direct and alternating current in the drive system, determining the torque and maximum output power of the vehicle, which can improve the efficiency and quality of electricity consumption, and has the characteristics of high efficiency, energy conservation, and green environmental protection.

Taking hybrid vehicles as an example, the specifications of IGBT modules are generally 600V~1200V/200A~800A. They generate a large amount of heat and are located in the front compartment of the car, along with the motor and engine. The space is enclosed and the heat is concentrated. If the temperature exceeds the junction temperature of IGBT by 125 ℃, it will cause the module to overheat and burn out. Therefore, heat dissipation has always been a top priority in IGBT design.

Diamond is currently known to have the highest thermal conductivity. Diamond has a thermal conductivity of up to 2000W/m.k, which is 5 times that of copper and silver. It is also a good insulator, making it an ideal heat dissipation material for high-power laser devices, microwave devices, and highly integrated electronic devices. Diamond is the preferred and only optional heat sink material for thermal conductivity requirements between 1000-2000W/m.k.

CSMH focuses on the research and production of diamond materials. The core product diamond heat sink has a thermal conductivity of 1000-2000W/m.k and a diamond wafer Ra<1nm. We are committed to providing customers with the most comprehensive diamond thermal management solutions and promoting the application of diamond wafers in new energy vehicles, high-power lasers, optical communication, satellites, 5G, aerospace and other fields, including diamond optical windows, diamond heterojunction integrated composite substrates, and aluminum nitride thin films.