With the continuous progress of chip technology and the increasing demand for applications, traditional semiconductor materials have gradually approached their performance limits. Therefore, finding and developing semiconductor materials with higher performance has become the key to the development of the next generation of chips.
Diamond, as a third-generation semiconductor material, has a wider bandgap, higher breakdown electric field, higher thermal conductivity, greater electron saturation velocity, and higher radiation resistance compared to the first and second generation semiconductor materials. It is more suitable for making high-temperature, high-frequency, radiation resistant, and high-power devices.
Advantages of diamond materials
High thermal conductivity
Broadband gap
High electron saturation drift velocity
Excellent chemical stability and high hardness
Excellent mechanical performance
Excellent optical performance
Good biocompatibility
Environmentally friendly
Strong customizability
The application fields of diamond materials
High frequency and high-power electronic devices: RF amplifiers, power transistors, etc
Electronic devices in extreme environments: spacecraft, nuclear energy devices, etc.
Biomedical applications: biosensors, medical devices, etc.
Environmental protection and energy sectors: optoelectronic devices and solar cells, etc
CSMH is based on the forefront of technology, mastering world-class diamond production processes, and has a mature diamond product system and system solutions, including diamond wafers, diamond heat sinks, diamond window sheets, diamond heterojunction integrated composite substrates, etc.
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