Diamond wafer：hexagonal soldier in the field of heat dissipation

Diamond has the highest thermal conductivity of any material, which makes it an excellent choice for thermal management in electronic equipment. Once a semiconductor device is manufactured, the chip must be packaged and built into an electrical system or electronic product. The excellent thermal properties of diamond materials, with the highest thermal conductivity and low thermal expansion coefficient, can be used for thermal management of power electronics.

Typical CVD diamond heat dissipation package geometry

The combination of high thermal conductivity and high dielectric strength of diamond heat sinks is very valuable for high-power laser diode arrays, RF modules and high-power transistors. Beryllium oxide ( BeO ) substrate is used in some electronic packaging applications due to its combination of high thermal conductivity and dielectric strength. The diamond heat sink replaces the toxic BeO and provides better heat dissipation performance.

Electronic heat sinks and packaging substrates made of diamond heat sinks are excellent in heat dissipation, and also electrically insulate microelectronic devices from other equipment and circuit components. Efficient heat dissipation extends the life of these electronic devices while preventing silicon and other semiconductor materials from overheating.

In the experiment of developing high electron mobility transistor ( HEMT ) ( diamond gallium nitride substrate for HEMT applications ), the thermal conductivity measurements of diamond gallium nitride ( GaN ) and silicon carbide gallium nitride ( SiC ) show that compared with SiC, diamond can reduce thermal resistance ( ° C / W ) by up to 58 % and the power density is three times higher. As a result, the power density of GaN-on-Diamond field effect transistor can be increased by three times. GaN diamond wafers will be an ideal platform for high-power GaN transistors deployed in cellular base stations and military communication applications.

CSMH focuses on the research and production of diamond wafers. At present, it has diamond wafers, diamond heat sinks, GaN on diamond, AlN on diamond and other products. Among them, high-power semiconductor lasers packaged by diamond heat sinks have been used in optical communications. In the fields of laser diodes, power transistors, and electronic packaging materials, it can provide customers with diamond thermal management solutions.