Silicon is a well-established semiconductor material that has addressed the requirements of energy conversion for more than 50 years. However, it is widely recognised (as shown in research roadmaps on power semiconductor devices [1]) that a real step-improvement in power electronics will be obtained by employing devices based on wide bandgap semiconductor materials. These materials have superior electrical characteristics for power devices when compared to silicon. Many grid applications use multilevel converters, with 3.3 kV (4.5 kV IGBT pressed (or stack) pack is commonly used fo HVDC and now 6.5 kV is also commercially available) silicon power semiconductors that need to be set in series to reach the required voltage level. Higher voltage capability devices are then highly required, 15 kV being a first step. To reach a high level current, paralleling of devices is required. Power electronic devices based on wide bandgap semiconductors are now resulting in substantial improvements in the performance of power electronics systems by offering higher blocking voltages, improved efficiency and reliability (higher performance/cost ratio), easier paralleling, and reduced thermal requirements, thus leading to the realization of more efficient green electronic systems.
Among wide bandgap semiconductors, diamond is considered to be the ultimate semiconductor for applications in high-power electronics due to its exceptional properties. Its dielectric breakdown strength is three times higher than in silicon carbide (SiC) and more than 30 times higher than in silicon (Si). In addition, unlike most other WBG semiconductors, the carrier mobility is very high for both carrier types, and the thermal conductivity is unsurpassed (see Table 1). In the latter, we indicate the commonly reported values of mobilities measured by Hall bars set-ups [2,3] on microwave-plasma-assisted chemical vapor deposition (MPCVD) layers. Note that some authors report much higher values when achieving the measurements with time of flight (TOF) set-ups on very high purity single-crystal diamonds. Values of electron and hole mobilities as high as 4500 and 3800 cm2/Vs have been reported [4]. Baliga’s figure of merit is oriented to static power losses. Another typical way to compare the power semiconductors is to draw the theoretical relationship between unipolar on-resistance versus the breakdown voltage of Schottky barrier diodes (SBDs). This is represented in Figure 1 for different semiconductors [5]. Power device engineering is interested in minimising the on-resistance for a given breakdown voltage capability. Diamond is the best candidate, and even Ga2O3, despite its lower carrier mobility, is better than SiC and GaN thanks to its high critical electric field.
Figure 1
ON-resistance and breakdown voltage of the different semiconductors at room temperature. Note that at high temperature diamond improves its characteristics (Reproduced with permission from Pearton et al. [5] Copyright 2021 ©AIP Publishing).
Diamond’s properties are strikingly superior to other semiconductors (see [5]) when considered for use in power electronic devices. Johnson’s figure of merit (FoM) is a measure of the ultimate performances of the electronic device at high power and high frequency of a transistor, Keyes’ FoM measures the performance limited by heat generation and removal, and Baliga’s FoM measures performance limited by losses at high-power and high-frequency operation. The properties/figure where diamond is outstanding for the present project are highlighted in orange.
Property (Unit), (See [5]) | Si | SiC-4H | GaN | Ga2O3 | Diamond |
---|---|---|---|---|---|
Bandgap (eV) | 1.1 | 3.23 | 3.42 | 4.8 | 5.45 |
Dielectric constant, ε | 11.8 | 9.7 | 9 | 10 | 5.7 |
Breakdown field (MV/cm) | 0.3 | 3 | 2 | 8 | 10 |
Electron mobility (cm2/Vs) | 1500 | 1000 | 2000 | 300 | 1000 |
Hole mobility (cm2/Vs) | 480 | 100 | 20 | 2000 | |
Thermal conductivity (W/cmK) | 1.5 | 5 | 1.5 | 0.27 | 22 |
Johnson’s figure of merit (1023 ΩW/s2) | 2.3 | 900 | 490 | 1236 | 2530 |
Keyes’ figure of merit (107 W/Ks) | 10 | 53 | 17 | 2 | 218 |
Baliga’s figure of merit (Si = 1) | 1 | 554 | 188 | 3214 | 23,068 |
An important aspect to rise is that Si power semiconductor switches used in 90% of the power applications market are metal-oxide semiconductor (MOS) gate-controlled devices (vertically diffused metal-oxide semiconductor, VDMOS, IGBT). Thyristor-based structures (integrated gate-commutated thyristors IGCT; gate turn-off thyristors, GTO) are still used for high-power high-voltage applications, mainly because of the lack of equivalent performance MOS controlled devices. This is something that diamond could solve considering its very high breakdown field above 10 MV/cm. In general, WBG semiconductors could open the way to novel concepts and applications in the high-voltage field such as electric transport and energy generation and distribution. Diamond, as a material with exceptional properties, could provide solutions to industry by providing diodes and transistors that withstand voltages above 10 kV, but competition with other materials, especially silicon carbide (SiC), and the intrinsic limitations of diamond (hardness, size of the substrate, etc.) require a great deal of effort to improve the performance, especially to reach high currents.
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