Increasing power densities and decreasing transistor dimensions are hallmarks of many of today’s semiconductor devices, including high-voltage power transistors, laser diodes, and RF power amplifiers. GaN devices, such as power converters for photovoltaic cells and cellular base-station power amplifiers, are further enabling higher power densities in smaller die sizes. Both trends are significantly increasing the thermal management challenge within the chip and surrounding package or module.
Thermal-management solutions for these high-power-density devices must go beyond today’s commonly used materials to prevent forcing designers to compromise on performance, or reduce their design thermal margins, impacting product reliability. Chip lifetimes are heavily dependent upon operating temperature, with every 10°C increase in junction temperature representing a 2x decrease in device lifetime. In fact more than half of the failures in today’s electronic systems are due to temperature.
Synthetic diamond is a good material for thermal management in semiconductor packaging for advanced electronic systems driving towards higher power density as it combines exceptionally high thermal conductivity with electrical isolation. Room temperature thermal conductivity values greater than 2000 W/m K have been reported for the highest quality polycrystalline synthetic diamond grown by microwave plasma assisted chemical vapor deposition (CVD) techniques. This is the highest value of all known materials and exceeds that of copper, which is commonly regarded as an excellent thermal conductor, by a factor of more than five and by over a factor of 10 higher than commonly used high K electrical insulators, such as aluminium nitride or beryllium oxide. The commercial availability of large CVD diamond plates has opened a host of possible options in which CVD diamond can be used in the heat management of electronic and opto-electronic devices. Control of diamond grown by CVD has allowed the synthesis of material with optimized cost/performance for various thermal management challenges in semiconductor packages and modules.
Rapidly increasing power densities are making the thermal management of semiconductor devices significantly more challenging. CVD synthetic diamond, with the highest thermal conductivity of any material, is therefore increasingly being used in heat spreaders for high-power die in such applications as high-voltage power switching for photovoltaic cells, planar optical ICs, and even high-power LEDs.
CSMH, a wide bandgap Semiconductor Material and Device company manufacturing with unique technology with investments from Korea, China, and Singapore. We are equipped with advanced semiconductor production equipment to produce high-quality Diamond wafers and AlN templates on a variety of substrates, including Si, sapphire, and polished diamond.
The company has built an intelligent manufacturing plant, started mass production of diamond wafers, diamond heat sinks, and has a substantial intellectual property (IP) portfolio. Our product's performance has improved to a level that is among the best in the world after more than 10 years of technological development.
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