Progress of Chemical Vapor Deposition (CVD) Diamond

Chemical vapor deposition (CVD) technology has enabled synthetic diamonds to be applied in many fields, in which the excellent comprehensiveness of diamond has been fully developed, and may lead to a leap-forward development.   Ultra-wide bandgap diamond semiconductor applications will soon be realized, and diamond heat dissipation applications are constantly expanding. By summarizing the preparation methods and characteristics of CVD diamond, according to the intrinsic characteristics of diamond, CVD diamond is classified into quantum grade, electronic grade, optical grade, thermal grade and mechanical grade.

"CVD diamond is the most thermally conductive material at room temperature, far surpassing the thermal conductivity of copper. With this new offering, we’re continuing to build our extensive portfolio of thermal grade materials to meet the needs of those in the microelectronics and electronics packaging industry,” said an expert. “Recognizing a ‘one-size fits all’ approach is not effective, we’re committed to providing a full range of options and specifications to effectively address thermal management challenges, including specific requirements for surface flatness, low roughness and metallization.”

CVD diamond is uniquely suited for advanced thermal management in applications such as advanced packaging, due to its exceptional combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. In this role, CVD diamond enables system size reductions, improved reliability and the opportunity to design higher power systems within an existing module footprint.

CSMH is an advanced semiconductor manufacturing technology based joint venture company that produces high quality Diamond heat sink, Diamond wafer and AlN template on various substrate including Si, sapphire, and polished diamond. We have strong R&D team and actively collaborate with best research group around the world.

Currently, we are providing the thermal grade polycrystalline diamond as an effective heat sink to solve the heat issue in temperature sensitive device, such as power devices, lasers and avalanche photodiodes etc. We also provides wafer scale polished diamond with sub-nanometer RMS surface roughness, which might be suitable for the integration of GaN, GaO and AlN epilayers and devices on Diamond via direct bonding or heteoepitaxy.