According to statistics, the failure of electronic components caused by heat concentration accounts for 55% of the total failure rate, and the heat dissipation design of the product has a crucial impact on the reliability of the product. CSMH, a joint venture company based on cutting-edge semiconductor manufacturing technologies has developed 4 inch diamond wafer and artificial diamond composite materials that can be used in a wide range of thermal management applications.
Artificial diamond is an ideal material for a range of thermal management applications, and has a thermal conductivity 5 times higher than copper. In addition, the material is an electric insulator. The build-up of heat can destroy delicate circuitry or severely impair performance in all types of electronic and electrical applications.
One of the first applications of synthetic diamond was as a heat sink for sensitive electronic components used in the telecommunications industry. CSMH has built an intelligent manufacturing plant, started mass production of diamond heat sinks, and has a substantial intellectual property (IP) portfolio.
CSMH can offer diamond heat sinks with thermal conductivity range from 1000 -2000 W/mK. This novel, top-end grade of CVD diamond material caters for advanced users that work with high power, or high power density devices, and require extreme performance for their thermal packaging needs.
In the near future, the CSMH will keep expanding its international sales and service network, as well as its development of global customer resources, in an effort to be the global leading provider for wide-bandgap semiconductor devices and materials.
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