Diamond Wafer in the 5G era - born for heat dissipation

The 5G era is coming, and it will inevitably involve the replacement of key components, ranging from core chips to radio frequency devices, and from base stations to applications, all of which need to be updated. With the increasing demand for thinner and lighter electronic products and higher performance, the power density of semiconductor components continues to increase, and the heat flux will also increase, some even as high as tens of kilowatts per square centimeter. 5 times, how to dissipate heat and cool the material becomes the primary problem.

So in the field of heat conduction and heat dissipation, how to choose materials?

Internet celebrity solution for thermal conduction and heat dissipation

At present, the more popular heat dissipation solutions mainly include graphite sheet, graphene, thermal interface material (TIM), heat pipe (HP), vapor chamber (VC) and semi-solid die casing. However, natural graphite heat dissipation film products are thicker and have low thermal conductivity, which is difficult to meet the heat dissipation needs of future high-power, high-integration-density devices, and also does not meet people's high-performance requirements for ultra-thin, long battery life. Therefore, it is of great significance to find new superthermal conductive materials. This requires such materials to have extremely low thermal expansion rates, ultra-high thermal conductivity, and thinness. Carbon materials such as diamond and graphene just meet the requirements. They have high thermal conductivity. Their composite materials are a class of thermally conductive and heat-dissipating materials with great application potential, and they have become the focus of attention.

Excellent thermal conductivity and heat dissipation of diamond

As a representative of the above materials, diamond is the material with the highest thermal conductivity in nature. The thermal conductivity (Type Ⅱ Diamond) at room temperature can reach 2000 W/(mK), and the thermal expansion coefficient is about (0.86±0.1)*10-5/K , and insulated at room temperature. In addition, diamond also has excellent mechanical, acoustic, optical, electrical and chemical properties, which make it have obvious advantages in the heat dissipation of high-power optoelectronic devices, which also shows that diamond has great application potential in the field of heat dissipation.

Principle of diamond thermal conductivity

Diamond is a cubic crystal formed by covalent bonding of carbon atoms. Many of diamond's extreme properties are a direct result of the strength of sp³ covalent bonds and a small number of carbon atoms that form a rigid structure. Metals conduct heat through free electrons, and their high thermal conductivity is associated with high electrical conductivity, by contrast, heat conduction in diamond is done only by lattice vibrations (i.e., phonons). The extremely strong covalent bonds between the diamond atoms give the rigid lattice a high vibrational frequency, resulting in its Debye characteristic temperature as high as 2,220 K. Since most applications are well below the Debye temperature, phonon scattering is small, so the resistance to phonon-mediated heat conduction is minimal. But any lattice defect produces phonon scattering, which reduces thermal conductivity, an inherent feature of all crystalline materials. Defects in diamond typically include point defects such as heavier 13C isotopes, nitrogen impurities and vacancies, extended defects such as stacking faults and dislocations, and 2D defects such as grain boundaries.

Compound Semiconductor Manufacturing (Xiamen) Co.,Ltd is a wide bandgap Semiconductor Material company invested from the Korea, China and Singapore, registered in the city of Xiamen, China.

We are equipped with advanced semiconductor manufacturing tools including MPCVD, MOCVD, LPCVD, HVPE and high temperature PVD.

Products including: high quality diamond wafer, diamond heat sink, GaN & Diamond wafer and PVD AlN template etc.

We have strong R&D team and actively collaborate with best research group around the world. Currently, we are providing the thermal grade polycrystalline diamond, which can be used as an effective heat sink aims to solve the heat issue in temperature sensitive device, such as power devices, lasers and avalanche photodiodes etc. We also provides wafer scale polished diamond with sub-nanometer RMS surface roughness, which might be suitable for the integration of GaN, GaO and AlN epilayers and devices on Diamond via direct bonding or heteoepitaxy.