Whenever we talk about semiconductor materials, people always unconsciously think of gallium arsenide, indium phosphide, gallium nitride (GaN) and silicon carbide (SiC), zinc oxide (ZnO), etc., while diamond as a new semiconductor material is always ignored. However, as the semiconductor industry becomes more and more mature, devices are also developing in the direction of high integration and high power, and the semiconductor materials of the past are no longer suitable for the development of the semiconductor era. Diamond can re-enter the human vision, so today we will take stock of why diamond can go from no one to occupy a place?
Diamond is a wide bandgap semiconductor material with excellent performance, and its excellent performance can be summarized as follows:
(1) Extremely high dielectric breakdown characteristics: The breakdown electric field is 107V/cm, which is 50 times that of GaAs materials, 2 times that of GaN materials, and 2.5 times that of SiC materials.
(2) Extremely high power capacity: the allowable power capacity of diamond is more than 2500 times that of Si material; It is especially suitable for the production of high-power electronic devices.
(3) Extremely high heat conduction: diamond has the highest thermal conductivity at room temperature, which is 5 times that of copper.
(4) Low dielectric constant: The dielectric constant of diamond is 5.7, about 1/2 of GaAs, which is smaller than half of InP, that is, at a given frequency, diamond semiconductors have a competitive capacitive load, which provides great convenience for the design of millimeter wave devices.
(5) High saturated carrier velocity: The saturated carrier velocity of diamond is 12.7 times that of GaAs, Si or InP, and the carrier velocity is greater than the peak of GaAs, that is, its high rate can be maintained when the electric field strength increases.
(6) High carrier mobility: both electron mobility and hole mobility are better than other semiconductor materials, diamond electron mobility is 4500cm2/ (V·s), while Si is 1600cm2/ (V·s), GaAs is 800cm2/ (V·s), GaN is 600cm2/(V·s); The hole mobility of diamond is 3800cm2/ (V·s), while Si is 600cm2/ (V·s), GaAs is 300cm2/ (V·s), GaN is less than 50cm2/ (V·s), therefore, diamond can make high-frequency electronic devices.
(7) Very high quality factor: Usually, the quality factor is determined by the saturated carrier velocity and dielectric strength. If the quality factor of Si is 1 as the benchmark, then the quality factor of GaAs is 7, the quality factor of InP is 16, the quality factor of SiC is 1138, and the quality factor of diamond is 8206. When its merit factor is used to determine the potential of logic circuits, the dielectric constant, saturated carrier velocity and thermal conductivity are the criteria, such as Si's criterion of 1, then GaAs is 0.456, SiC is 5.8, diamond is 32.2, therefore, in theory, diamond is most suitable for integrated circuit use.
(8) Excellent optical properties: Diamond not only has excellent electrical properties, but also has excellent optical properties. Diamond, in addition to the presence of intrinsic absorption in some wavelengths of ultraviolet and infrared, is transparent in the entire spectral band (ultraviolet, visible, infrared) and has an unusually high refractive index, therefore, diamond is the most ideal optical window material.
(9) Extremely high hardness and high chemical stability: Diamond not only has a dense structure, wear resistance, low friction factor and extremely high hardness, but also is absolutely stable and resistant to chemical corrosion in most environments.
Figure 1 Excellent characteristics of diamond
CSMH is a well-known semiconductor company focusing on the production and research and development of diamond, which produces diamond wafer Ra<1nm, diamond hot sink thermal conductivity 1000-2000W/m.k, and GaN on diamond, Diamond on GaN, diamond-based aluminum nitride and other products. And the use of diamond heat sinking high-power semiconductor lasers have been used in optical communications, in laser diodes, power transistors, electronic packaging materials and other fields have also been applied. Here, we will take you through a different diamond thermal management solution.
Figure 2 High-quality wafer-grade diamonds produced by CSMH
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