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Excellent heat dissipation material, diamond wafer
"Ultimate Semiconductor", Diamond Wafer Reveals New possibilities
Supporting cutting-edge fields, the "quantum future" of diamond wafers
Diamond wafer, an excellent heat sink material for high-power semiconductor laser packaging
Diamond/copper composite material, ultra-high thermal conductivity semiconductor packaging substrate
Diamond wafer: an essential part of 5G communication field
Research on GaN Heat Dissipation Technology for Diamond Wafer Substrates
Diamond Wafer Substrate: The Future of GaN Power Devices
Diamond wafers: efficient solutions for thermal conductivity and heat dissipation
The application prospects of diamond in the aerospace field
Diamond wafer solves the heat dissipation problem of high-power devices
Application of Diamond wafer in Thermal Management of GaN High Power Devices
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Products
Single Crystal Diamond Wafer
Diamond Wafer
Diamond Heat Sink
Diamond Optics
B-doped single crystal diamond
GaN on Diamond
AlN on Silicon
AlN on Sapphire
AlN on Diamond
CVD diamond film for treble speaker
Carbon matrix composite
Application
Lasers
5G Base Stations
High-speed Rail
New Energy Vehicles
High-power LED
New Energy Photovoltaic
Wind Power
Satellite Communication
Radar
Knowledge
Video
Download
Technology
About
Company Profile
Honors & Certifications
Company News
Industry News
Contact
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