Diamond Heat Sink : Empowering Advanced Packaging Technologies

The growing trend toward lighter, thinner, shorter, smaller, and more portable electronic devices is closely linked to the rapid advancement of various advanced and novel packaging technologies. These cutting-edge packaging solutions rely heavily on the development of new packaging materials, among which diamond stands out as the most promising candidate.

Diamond is an ideal material for most high-performance microcircuits. It boasts the highest thermal conductivity in nature (up to 2000 W/m·K), while also being the hardest known material with exceptional chemical stability. Depositing a thin diamond film on Al₂O₃ substrates—known for their poor thermal conductivity—can significantly enhance their heat dissipation capabilities.

For instance, GaAs ICs (Gallium Arsenide Integrated Circuits) face significant heat dissipation challenges. However, when mounted on diamond substrates or Al₂O₃ substrates coated with diamond films, GaAs ICs can operate reliably and efficiently.

Currently, extensive efforts are focused on optimizing adhesives, fabricating large-size substrates, increasing deposition rates, and reducing deposition temperatures. These initiatives aim to expand the application scope of diamond in electronic products.

As the foundation and precursor of the aforementioned novel packaging technologies, diamond has paved the way for emerging packaging fields such as MEMS (Micro-Electro-Mechanical Systems) and MOEMS (Micro-Opto-Electro-Mechanical Systems). The shift from 2D to 3D packaging is an inevitable requirement for achieving lighter, thinner, shorter, and smaller electronic devices (e.g., mobile communication products) and a natural outcome of the continuous increase in packaging density. This trend will remain a core focus of technological development in the years to come.

The boron-doped single-crystal diamond produced by CSMH can achieve doping from low concentration to high concentration. It has realized a uniform and controllable concentration and a customizable boron doping process.CSMH uses the MPCVD method to prepare large-sized and high-quality diamonds,and currently has mature products such as diamond heat sinks, diamond wafers, diamond windows,diamond hetero junction integrated composite substrates,etc.