The development trend of UAVs (Unmanned Aerial Vehicles) exhibits characteristics such as diversification, technological innovation, intelligence, lightweight design, and modular design. In the future, UAVs will be capable of providing more accurate, efficient, and secure capabilities.
As the integration level of chips increases and packaging space becomes more compact, diamond substrates, relying on their excellent thermal conductivity, high hardness, and strength, can provide support and protection for chips in limited spaces. At the same time, their low thermal expansion coefficient ensures that the connection stability between chips in a high-density assembly environment is not affected by temperature fluctuations.
By exciting diamonds with lasers, the generated light beams can maintain high-quality irradiation effects over long distances. This technology enhances the ground power supply network, avoiding the energy waste caused by UAVs carrying large batteries and thus enabling longer flight distances. If laser charging technology operates with this effect, UAVs will be able to fly hundreds of miles without relying on heavy batteries. A palm-sized UAV that consumes 2 to 3 watts of power and has a flight time of 30 minutes can be fully charged in just 1 minute.
The boron-doped single-crystal diamond produced by CSMH can achieve doping from low concentration to high concentration. It has realized a uniform and controllable concentration and a customizable boron doping process.CSMH uses the MPCVD method to prepare large-sized and high-quality diamonds,and currently has mature products such as diamond heat sinks, diamond wafers, diamond windows,diamond hetero junction integrated composite substrates,etc.
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