Diamond wafer: Efficient heat sink material in the electronic field

With the development of technology, electronic devices are constantly moving towards high density and high integration. However, this also means that more heat will be generated during the working process. If this heat is not discharged in a timely manner, electronic integrated circuits will face the risk of damage. In order to meet higher heat dissipation capabilities, there are higher requirements for the performance of electronic heat sink materials.

The general requirements for heat sink materials are:

Firstly, it has a lower coefficient of thermal expansion to meet the matching requirements between heat sink materials and chips;

Secondly, the thermal conductivity of the heat dissipation material is good to ensure heat dissipation;

Thirdly, strong conductivity is the key to ensuring the stable operation of electronic components;

Fourthly, the characteristics of corrosion resistance and weldability are aimed at ensuring the service life of heat sink materials

Fifth, ensure the airtightness of the heat sink material.

The difference in thermal expansion coefficients between metal heat sink materials can lead to thermal stress and even deformation in electronic components. As the hardest material in the world, diamond has excellent hardness and corrosion resistance, and its low coefficient of thermal expansion and ultra-high thermal conductivity make it the most ideal electronic heat sink material.

CSMH focuses on the research and development, production, and sales of diamond materials. Its core products include diamond wafers, diamond heat sinks, diamond windows, and diamond hetero-integrated composite substrates. Among them, the surface roughness of the diamond wafer Ra<1nm; The thermal conductivity of diamond heat sinks can reach 1000-2000W/(m.K). At present, diamond heat sinks are widely used in high-power semiconductor lasers, drones, aerospace, radar, new energy vehicle IGBTs, and other fields.