Diamond application: chip aging testing machine achieves efficient heat dissipation

Chip aging testing plays a crucial role in the development and production of semiconductor electronic products. Its core goal is to simulate the high-temperature environment that chips face in actual operation, in order to evaluate their operating conditions and performance under extreme temperature conditions. Through aging testing, we can gain a more comprehensive understanding of the performance of chips in high-temperature environments, which is crucial for ensuring the quality and reliability of electronic products.

However, chip temperature aging tests are usually conducted in high-temperature environments, with aging test temperatures ranging from -40 ° C to+200 ° C and continuous aging test times typically ranging from a few hours to several days. This requires higher performance requirements for the copper base of the aging test machine, including wear resistance, thermal conductivity, etc. Diamond wafers are the best choice!

Diamond has extremely high thermal conductivity. At room temperature, its thermal conductivity is 5 times that of copper and 15 times that of silicon, giving it a significant advantage over other substances. Combining the copper base with the diamond layer can greatly improve the heat dissipation capacity of the copper base. The chip can be directly placed on the surface of the diamond layer of the copper base to meet the requirements of high-power chip aging testing, avoiding the use of soft solder melting causing reverse adhesion and chip scrap.

CSMH has been deeply involved in the production and research and development of diamond materials, with mature thermal management solutions. Its core products include diamond wafers, diamond windows, diamond heat sinks, diamond heterojunction integrated composite substrates, etc. It also innovates the technology of combining diamond and chip aging testing machine copper seats to help improve heat dissipation performance.