Advantages of using diamond material for aging test copper seats

The aging copper seat of the original chip is in direct contact with the contact area of the chip, which has the defect of insufficient heat dissipation and cannot meet the requirements of aging testing. Diamond, as a high thermal conductivity material, combined with copper seats can improve the thermal conductivity of aging test seats.

With the rapid development of semiconductor technology and the increasing complexity of chips year by year, chip testing has become increasingly challenging. If the heat dissipation problem of copper seats is not solved, it will directly affect device performance, lead to a decrease in lifespan and reliability, and even damage the chip.

Diamond has excellent properties such as wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. It is currently one of the most promising semiconductor materials, and its classic application scenario is in the field of thermal management. By utilizing the high thermal conductivity of diamond, the temperature thermal equilibrium time during the testing process can be shortened, and the efficiency of aging testing can be improved.

In addition, diamond has the highest hardness or penetration resistance among all known materials, and can even wear the hardest ceramic materials. Diamond hardness: Mohs hardness 10, new Mohs hardness 15, microhardness 10000kg/mm ².When using diamond as a transitional heat sink in aging testing of copper seats, the wear resistance of diamond can provide the lifespan of the copper seat for testing. 

CSMH focuses on the production and research of diamond materials, mastering the internationally leading diamond production technology, and can provide corresponding solutions according to different customer needs. Among them, the surface roughness of diamond wafers is Ra<1nm, and the thermal conductivity of diamond heat sinks reaches 1000-2000W/(M.K). The products include diamond wafers, diamond heat sinks, diamond window chips, diamond heterojunction integrated composite substrates, etc, It can meet the cooling needs of many high-power devices. Welcome to consult.