Diamond helps improve the heat dissipation performance of chip aging testing machines

Chip aging testing is widely used in the development and production of semiconductor electronic products. Its purpose is to test the operation and performance changes of chips at high temperatures by simulating the high-temperature environment under actual operating conditions. This test is an essential step in the quality control process of electronic products.

However, chip temperature aging tests are usually conducted in high-temperature environments, with aging test temperatures ranging from -40 ° C to+200 ° C and continuous aging test times typically ranging from a few hours to several days. This requires higher performance requirements for the copper base of the aging test machine, including wear resistance, thermal conductivity, etc. Diamond wafers are the best choice!

Diamond has extremely high thermal conductivity. At room temperature, its thermal conductivity is 5 times that of copper and 15 times that of silicon, giving it a significant advantage over other substances. Combining the copper base with the diamond layer can greatly improve the heat dissipation capacity of the copper base. The chip can be directly placed on the surface of the diamond layer of the copper base to meet the requirements of high-power chip aging testing, avoiding the use of soft solder melting causing reverse adhesion and chip scrap.

CSMH has been deeply involved in the production and research a of diamond materials, with mature thermal management solutions. Its core products include diamond wafers, diamond optical windows, diamond heat sinks, diamond heterojunction integrated composite substrates, etc. It also innovates the technology of combining diamond and chip aging testing machine copper seats to help improve heat dissipation performance.