Diamond Solutions: A High Heat Dissipation Chip Aging Test Seat

With the rapid development of semiconductor technology and the increasing complexity of chips, the requirements for chip aging testing equipment are becoming increasingly strict. In order to address these challenges, equipment manufacturers urgently need to find high-frequency and high-power device materials that can withstand high temperatures, high voltages, and large currents. Among numerous options, diamond with ultra-high thermal conductivity stands out as the most ideal choice.

The aging test seat in existing technology uses copper seat, which has poor heat dissipation performance and is prone to causing the tested chip to be scrapped. Among them, the most common one is the dissolution of the thermal conductive medium in the tested semiconductor chip, which leads to uneven contact between the product and the medium, and incomplete heat transfer. The semiconductor temperature will continue to rise until it exceeds the maximum temperature set by the system. The testing machine system will determine that the semiconductor chip has failed, cut off its testing voltage, and label it as a defective product. Offline operators will pick out the chips and identify them as invalid, and will not send them back to the aging room but directly to the disposal room. As the chips themselves are high-value products, the occurrence of a large number of similar failures is an unacceptable loss for the company's benefits.

Diamond materials have ultra-high thermal conductivity. At room temperature, the thermal conductivity of diamond is 5 times that of copper and 15 times that of silicon. The combination of diamond and copper seats has the characteristics of high efficiency, low energy consumption, and fast heat dissipation, greatly improving the heat dissipation effect of the aging test seat and better protecting the chip to complete the aging test.

CSMH focuses on the production and research of diamond materials, mastering the world-class diamond production process, and creating a unique diamond copper seat process to solve the heat dissipation problem of chip aging testing machines. This new type of chip aging testing seat is more convenient to replace, easy to operate, greatly improving the efficiency of chip testing and facilitating automated production.