Compared with common heat sink materials, diamond wafers have obvious advantages

Semiconductor lasers have small size and long lifespan, and can also be applied in radar, sound measurement, and medical fields in addition to communication. However, research has found that heat dissipation affects the lifespan and usage of semiconductor lasers. Excessive CPU temperature can cause the computer to automatically shut down, blue screen, crash, and lag. Prolonged high temperature can affect its lifespan. According to statistics, electronic component failures caused by heat concentration account for 55% of the total failure rate, and product heat dissipation design has a crucial impact on product reliability. Whether it is high-power devices or power electronics, thermal management is particularly important.

Semiconductor power devices mainly use these three types of materials as heat sinks:

Ceramic materials: such as aluminum nitride, beryllium oxide, and aluminum oxide. The thermal conductivity is 170-230 W/m.k, 190 W/m.k, and 20 W/m.k, respectively. The impurities and defects generated during the sintering process of aluminum nitride cause the actual thermal conductivity of the product to be lower than the theoretical value. The production cost of beryllium oxide is high and highly toxic, and the thermal conductivity of alumina is the lowest

Metal materials: such as aluminum and copper. The thermal conductivity is 230 W/m.k and 400 W/m.k respectively, but the thermal expansion coefficients of metal aluminum and copper are relatively large, which may cause serious thermal mismatch problems.

Composite materials: such as aluminum silicon carbide. It is a metal matrix composite material that combines SiC ceramics and metal Al, with a thermal conductivity of 200 W/m.k. It is necessary to match the thermal expansion coefficient of adjacent materials by changing the content of SiC, which increases debugging costs

Advantages of diamond heat sink：

Diamond has the highest thermal conductivity at room temperature, 5 times that of copper and silver, and is also a good insulator, making it an ideal heat dissipation material for high-power laser devices, microwave devices, and highly integrated electronic devices. Diamond is the preferred and only optional heat sink material for thermal conductivity requirements between 1000-2000W/m.k.

CSMH is committed to the production and research of diamond materials, with core products including diamond wafers, diamond heat sinks, diamond optical windows, diamond heterojunction integrated composite substrates, etc. Among them, the surface roughness of diamond wafer growth surface Ra<1nm, and the thermal conductivity of diamond heat sinks reach 1000-2000W/m.k. Currently, it is applied in high-power lasers, aerospace, new energy vehicles, medical devices, radar, new energy photovoltaics, and other fields.