The heat dissipation of semiconductor laser chips has always been a challenge in the industry. During the use of semiconductor lasers, when the heat of the chip accumulates to a certain extent, the semiconductor laser will overheat, causing the laser cluster to extinguish and limiting high-power laser output. So solving the heat dissipation of semiconductor lasers is of great significance for improving the performance of lasers, and diamond wafers will play a crucial role in this laser revolution.
Compared with traditional material lasers, using diamond as a heat sink, transmission window, reflection window, and beam splitter can ensure stable operation of the laser at a relatively high performance level even at high power.
As an important "carbon material", diamond has excellent characteristics such as wide spectral transmittance, low coefficient of thermal expansion, high mechanical strength, high heat resistance, shock heat resistance, low scattering, high laser-induced damage threshold, low absorption, high Raman gain coefficient, and high thermal conductivity, providing excellent advantages for optical applications such as lasers.
The transmission spectrum of diamond covers the range from ultraviolet, visible light, infrared to radio waves, and was initially used as a high refractive index material for microscopes and as an infrared transmission window in extreme environments. The intrinsic optical properties of diamond are determined by its bandgap width in deep ultraviolet, with a cutoff wavelength of 225 nm (5.47 eV); Among them, between 2.5 and 6 μ There is weak absorption between m, mainly determined by its phonon band absorption. In addition, the large bandgap of diamond avoids the charge carriers generated by diamond crystals at high temperatures, so even at very high temperatures and radiation intensities, diamond can still maintain high transparency.
In addition, diamond has excellent thermal conductivity, with a thermal conductivity of up to 2200 W/(m · K), which is more than 140 times that of commonly used laser crystal YAG and nearly 13 times higher than monocrystalline silicon in the same fourth group. The extremely high thermal stability also enables diamond to exhibit excellent performance under harsh working conditions of high temperature and strength, making it widely used in material cooling and other fields.
In addition, the current main applications of thermal grade CVD diamond are high-power semiconductor diode lasers, heat sinks (heat sinks) for diode laser arrays, GaN on diamond composite sheets, and satellite heat expansion plates. Mainly used for optical communication (optical transceiver) and military. At present, the output power of high-power diode laser arrays has reached over 1 kilowatt, which will definitely have a wide range of applications not only in military but also in civilian technology in the future (such as for laser processing).
CSMH focuses on the production and research of diamond materials, with world-class diamond production processes and diamond heat dissipation solutions. Currently, the diamond wafers Ra<1nm, and the thermal conductivity of diamond heat sinks is 1000-2000W/m.k. Customers have proven that using CSMH's diamond wafers as heat dissipation materials can effectively dissipate heat, improve the performance and stability of electronic devices.
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