High thermal conductivity
600-950 W/m·K
Low density
5.8-7.0(±0.1) g/cm3
Low coefficient of thermal expansion
4-10 10-6/K
large-sized
<200*200 mm
Copper-diamondcomposite is an isotropic, high thermal conductivity, low coefficient of thermal expansion lightweight thermally conductive composite material. Its organisational composition is made of diamond powder and copper matrix at high temperature and high pressure. Diamond-copper composite material is suitable for chip packaging substrate, with high thermal conductivity and the thermal expansion coefficient matched with the chip and other characteristics, the performance can be adjustable in a wide range of areas to meet the needs of chip packaging.
Communication
Optical Modules
Military
AI
New Energy
RF, optical module, CPU and other fields
Replace CMC, CPC， thermal conductivity increased by 3 times
Anisotropic thermally conductive components
application area
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