Position:
Telecommunications
Home Appliances
Military
Other electronic products
Used in 5G base station heat dissipation fins for telecommunication manufacturers; chip junction temperature down 3-4℃.
Replacement of aluminium plate, used for 8K TV core heat dissipation; chip junction temperature decreased by 5-6℃.
Replacement of aluminium alloy for aerospace boards, heat spreader plates and other thermally conductive components.
Reduce weight by 2-3% and increase the overall equivalent thermal conductivity by 1 times.
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