Home
Products
Diamond
Thermal
12inch Si &Si diamond
diamond heatsink
Wafer substrate
Wafer boding
Optics
Optical window
Flange
Semiconductors
Large size single crystal
doped-diamond
doped-diamond
devices
Ir substrate
Acoustics
Diaphragm
Flexible films
Flexible films
Equipment
MPCVD
Grinding and polishing equipment
Other
Solid state power supply
Heat dissipation material
Diamond composites
Diamond-Cu
Diamond-Al
Graphite composites
Graphite-Cu
Graphite-Al
Heat sink materials
AlN heat sink
SiC heat sink
Al2O3 heat sink
WCu
MoCu
TIM
TIM1;TIM2
X-ray diamond
X-ray tube
X-ray tube
X-ray diamond target
X-ray diamond target
Aging equipment base
Diamond metallization sheet
Diamond metallization sheet
Diamond and copper base welding
Diamond and copper base welding
Customized services
Processing services
grinding & polishing
cutting
punching
Metal coating
Coating Cu, Au, Al,Ti ...
AlN Flim
AlN on Si
AlN on Sapphire
AlN on diamond
Heteroepitaxial growth
Ga2O3 on diamond
Welding services
Welding services
Testing services
Testing services
Application
Lasers
5G Base Stations
High-speed Rail
New Energy Vehicles
High-power LED
New Energy Photovoltaic
Wind Power
Satellite Communication
Radar
Knowledge
Video
Download
Technology
About
Company Profile
Honors & Certifications
Company News
Industry News
Contact
CN
Knowledge
Video
Download
Technology
Diamond Wafer: X-ray Windows
Diamond Heat Sink-for Chip Heat Dissipation
Diamond Heat Sink- the First Choice for Chip Packaging
Optimizing activation process for strong direct bonding between diamond wafer and Si substrates
Electrical and Thermal Performance of AlGaN/GaN HEMTs on Diamond Substrate for RF Applications
Diamond Heat Sink——Born For Heat Dissipation
Diamond Wafer as the heat spreader for the thermal dissipation of GaN-based electronic devices
The New Future of "Heat Conduction and Heat Dissipation" —— Diamond Heat Sink
The Future of High Resistive Components Is In CVD Diamon Heat Sink
Diamond wafer as the heat spreader for the thermal dissipation of GaN-based electronic devices
Diamond wafer—the influence of the position on the heat dissipation ability of devices
Abnormal Thermal Response of Diamond Wafer under Uniaxial Strain
Home
Pre
9
10
11
12
13
14
15
Next
Last
12/ 30
Page: 12
Leave A Message
If you are interested in our products and want to know more details,please leave a message here and we will Reply you as soon as we can.
*
Name
*
Title
*
Company
*
Email
*
Tel
Message
Submit
Products
Diamond
Heat dissipation material
X-ray diamond
Aging equipment base
Customized services
Application
Lasers
5G Base Stations
High-speed Rail
New Energy Vehicles
High-power LED
New Energy Photovoltaic
Wind Power
Satellite Communication
Radar
Knowledge
Video
Download
Technology
About
Company Profile
Honors & Certifications
Company News
Industry News
Contact
Contact Us
©2022 Compound Semiconductor (Xiamen) Technology Co., Ltd. copyright
sitemaps
闽ICP备2021005558号-1
Go Back
Contact Us
Send an Inquiry
Leave A Message
*
Name:
*
Title:
*
Company:
*
Email:
*
Tel:
Message:
Submit