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Technology
Diamond wafer, an excellent heat sink material for high-power semiconductor laser packaging
Diamond/copper composite material, ultra-high thermal conductivity semiconductor packaging substrate
Diamond wafer: an essential part of 5G communication field
Research on GaN Heat Dissipation Technology for Diamond Wafer Substrates
Diamond Wafer Substrate: The Future of GaN Power Devices
Diamond wafers: efficient solutions for thermal conductivity and heat dissipation
The application prospects of diamond in the aerospace field
Diamond wafer solves the heat dissipation problem of high-power devices
Application of Diamond wafer in Thermal Management of GaN High Power Devices
Cu-diamond composite material: heat dissipation research on fin heat sink
Selection of heat sink for laser chip packaging
Diamond heterojunction integration for thermal management of electronic device packaging
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