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Diamond Heat Sink- the First Choice for Chip Packaging
Optimizing activation process for strong direct bonding between diamond wafer and Si substrates
Electrical and Thermal Performance of AlGaN/GaN HEMTs on Diamond Substrate for RF Applications
Diamond Heat Sink——Born For Heat Dissipation
Diamond Wafer as the heat spreader for the thermal dissipation of GaN-based electronic devices
The New Future of "Heat Conduction and Heat Dissipation" —— Diamond Heat Sink
The Future of High Resistive Components Is In CVD Diamon Heat Sink
Diamond wafer as the heat spreader for the thermal dissipation of GaN-based electronic devices
Diamond wafer—the influence of the position on the heat dissipation ability of devices
Abnormal Thermal Response of Diamond Wafer under Uniaxial Strain
Diamond wafer substrates in power electronic devices
Diamond wafer power devices will become a new choice for chips
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Products
Single Crystal Diamond Wafer
Diamond Wafer
Diamond Heat Sink
Diamond Optics
B-doped single crystal diamond
GaN on Diamond
AlN on Silicon
AlN on Sapphire
AlN on Diamond
CVD diamond film for treble speaker
Carbon matrix composite
Application
Lasers
5G Base Stations
High-speed Rail
New Energy Vehicles
High-power LED
New Energy Photovoltaic
Wind Power
Satellite Communication
Radar
Knowledge
Video
Download
Technology
About
Company Profile
Honors & Certifications
Company News
Industry News
Contact
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