Faced with various limitations of traditional packaging materials, more and more new heat dissipation materials have been developed. Diamond has excellent mechanical, optical, electrical, acoustic, and chemical properties, making it significantly superior to other materials in high-power optoelectronic device heat dissipation. At present, diamond wafers have demonstrated excellent heat dissipation capabilities in fields such as optical communication, chip cooling, new energy vehicles, and high-power devices, providing new heat dissipation ideas for the development of power devices towards integration and high-frequency.
Diamond has a thermal conductivity of up to 2000W/(m.K), which is 3-5 times that of copper, 6 times that of AlN, and more than 7 times that of BeO. It can transfer heat generated by electronic devices and has high electrical resistivity, making it a typical insulator. Therefore, diamond is the most ideal heat sink material.
High power electronic devices: Diamond heat sinks can effectively solve heat dissipation problems and improve the performance of power devices at the same size. The size of diamond heat sinks is no longer limited to individual devices or small arrays, and the array size can be extended to a few centimeters. Diamond used in various devices,it can significantly improve the reliability of the system and reduce the size and cost of the system.
Chip heat dissipation: Another more attractive application prospect of diamond heat sinks is in the developing multi chip assembly technology, which aims to tightly arrange many ultra large scale integrated circuit chips in a three-dimensional manner to form ultra small and ultra-high performance devices. The heat dissipation of these chips is the key to this technology, and diamond heat sinks are the most ideal material to solve this technical problem.
Optical communication: The emergence of large-area and high thermal conductivity CVD diamond films has made it possible for their thermal management applications in high-power laser diode arrays (LDAs) and other microelectronic and optoelectronic devices.
Military aerospace: By using direct bonding, GaN diamond heterojunction bonding structures have been prepared using chemical integrated deposition, and their interfacial thermal conductivity is comparable to that of epitaxial growth methods. GaN is accelerating the exploration of applications in the aerospace field, and the combination of GaN and diamond will achieve a significant leap in performance.
New energy vehicles: Unlike the upper limit of 200℃ (392 °F) of SiC, diamond can operate above 500℃. Many similar challenges faced in military aviation applications, such as high temperatures, also apply to the automotive industry, where it is necessary to reduce the overall heat loss of engines.
5G base station: Currently, the average power consumption of a single tenant of a 5G outdoor base station is around 3.8KW, which is more than three times that of a 4G base station. The cost of electricity may overdraw all the profits of the operator. The 5G market is about to expand, and diamond, as a thermal management material for 5G base stations, will greatly save electricity by fully leveraging its excellent heat dissipation performance, truly achieving green, environmental protection, and low-carbon.
CSMH is committed to the research and production of diamond materials, with advanced diamond preparation and processing technology, providing customers with comprehensive diamond heat dissipation solutions to help improve the performance of power devices. Its core products include diamond heat sinks, diamond wafers, diamond windows, diamond heterojunction integrated composite substrates, etc. Currently, it is applied in high-power lasers, new energy vehicles, optical communication, radar, military aerospace and other fields.
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