Advantages of Diamond Heat Dissipation, Comparison with Other Materials, and Future Development Trends

High Thermal Conductivity: Diamond is one of the materials with the highest known thermal conductivity, reaching 2000 W/m·K, which is much higher than that of materials such as silicon (Si), silicon carbide (SiC), and gallium arsenide (GaAs). This allows heat to be transferred more quickly from the active silicon layer to the copper layer.

Performance Enhancement: Diamond heat dissipation technology can increase the computing power of GPUs and CPUs by 3 times, reduce temperature by 60%, and lower energy consumption by 40%.

Miniaturization and Lightweight: Diamond chips can make converters 5 times lighter and smaller in volume, contributing to the miniaturization and lightweight of devices.

Cost Reduction: Compared with SiC, diamond chips can be 30% cheaper, requiring only 1/50 of the material area of SiC chips and reducing energy loss by 3 times.

Wide Applications: Diamond heat dissipation technology shows broad application prospects in fields such as AI, HPC, electric vehicles, space satellites, drones, and quantum computing.

Future Development Trends:

Market Size Growth: The diamond heat dissipation market is expected to reach $50 million in 2025 and grow to $15.24 billion by 2030, with a compound annual growth rate of 214%.

Expansion of Application Fields: With technological progress and cost reduction, diamond heat dissipation technology is expected to be widely applied in data centers, new energy vehicles, consumer electronics, satellite communications, drones, and humanoid robots.

Technological Breakthroughs: With in-depth research and development of diamond materials, more breakthroughs are expected in the future in diamond chip manufacturing, doping technology, and optimization of heat dissipation solutions.

Industrialization Process: As technology matures and the market expands, the industrialization of diamond heat dissipation technology is expected to accelerate