New Material "Diamond" Helps Solve GPU Heat Dissipation Problems

With the rapid development of technologies such as 5G and artificial intelligence, the computing power of electronic devices continues to improve, and the heat generation of chips also increases accordingly. Poor chip heat dissipation can lead to device overheating, which in turn affects the performance and lifespan of the device. Diamond with ultra-high thermal conductivity has brought a new and efficient chip cooling solution to the chip industry, which will provide strong support for the stable operation of electronic devices.

High performance means high energy consumption, and when the GPU operates under high loads, it generates a large amount of heat, thus requiring more efficient cooling solutions. Intel is the first to adopt diamond cooling solutions in silicon microchips, with chip speeds at least twice the rated speed. According to reports, this solution was tested on Intel's unreleased high-end Nvidia GPU, and its performance is three times that of ordinary chips based on standard manufacturing materials.

Diamond is an excellent heat dissipation material with the following advantages:

(1) High thermal conductivity: Thermal conductivity of 2200W/m.K, diamond has the highest thermal conductivity at room temperature;

(2) Having a lower coefficient of thermal expansion to meet the matching requirements of heat sink materials and chips;

(3) Strong conductivity is the key to ensuring the stable operation of electronic components;

(4) Ultra high hardness: Mohs hardness of 10, new Mohs hardness of 15, microhardness of 1000kg/mm2, is the highest hardness material among all known materials;

(5) Chemical stability: Diamond not only has a dense structure, wear resistance, low friction coefficient, and extremely high hardness, but also is absolutely stable and resistant to chemical corrosion in most environments.

With less dissipation loss, excellent heat dissipation, and stable operation ability at high temperatures, diamond heat sinks have been applied to high-end processors such as GPUs, which can effectively improve the working efficiency and lifespan of devices, thereby further improving the performance of equipment.

CSMH focuses on the research and development, production, and sales of diamond materials, mastering mature diamond heat dissipation products and solutions. Its core products include diamond wafers, diamond heat sinks, diamond windows, and diamond hetero-integrated composite substrates. Among them, the thermal conductivity of diamond heat sinks is as high as 1000-2000W/(m.K). In addition to the GPU field, diamond heat sinks are also applied in high-power semiconductor lasers, drones, aerospace, radar, new energy vehicle IGBTs, and other fields.