Application of Diamond Polycrystalline in Heat Dissipation Field

1. Diamond heat sinks  in semiconductor lasers

Diamond heat sinks are used in semiconductor lasers, which can significantly improve the heat dissipation efficiency. For example, high-quality diamond heat sinks prepared by advanced MPCVD technology can be utilized to achieve a cooling effect of about 25°C in semiconductor lasers and increase the power by 15%. In addition, the application of diamond heat sinks in IGBT modules also significantly reduces thermal resistance and extends module life by 30%.

2. Diamond heat sinks  in semiconductor lasers

Diamond heat sinks are used in semiconductor lasers to significantly improve heat dissipation efficiency. At present, high quality CVD diamond heat sinks prepared by advanced MPCVD technology can realize about 25°C cooling effect in semiconductor lasers and increase the power by 15%. In addition, the application of diamond heat sinks in IGBT modules also significantly reduces thermal resistance and extends the life of the module by 30%.

3.  Diamond heat sink  in advanced packaging technology

Chinese research team has successfully integrated polycrystalline diamond substrate into the backside of 2.5D glass adapter plate packaging chip. This technology utilizes the ultra-high thermal conductivity of diamond, which can reduce the maximum junction temperature of the chip by 24.1°C and the thermal resistance of the package by 28.5% when the hot spot power density of the chip is about 2 W/mm². This breakthrough progress shows that the advanced package integrated chip heat dissipation based on diamond substrate has significant application prospects.

4. Diamond in high-power devices

Diamond material is known as the fourth generation of heat dissipation materials, for high-power electronic devices, semiconductor chips and other key devices have an important role in heat dissipation. For example, large-size, high-quality diamond films prepared by CSMH using microwave plasma chemical vapor deposition (MPCVD) are used in semiconductor lasers as heat-sinking materials, and metallization layers are deposited on the surface of CVD diamond heat-sinking sheets by magnetron sputtering system, which significantly improves the heat dissipation efficiency.

These cases demonstrate the wide application of diamond polycrystalline materials in the field of heat dissipation and its remarkable effect. With the further development of the technology, the application of diamond polycrystalline materials in the field of heat dissipation will be more extensive.