Customized high thermal conductivity diamond heat sink, providing customers with more diamond therma

The world leader in synthetic diamond supermaterials   announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD) diamond.The diamond heat sink has a thermal conductivity in excess of 1500±200 W/mK，offers full isotropic heat spreading in both planar and through plane directions. Enhancing its already extensive portfolio to offer customers more options to address unique thermal management needs, now provides a total of many material grades spanning many levels of performance ranging from 500 W/mK to 2000 W/mK.

CVD diamond is the most thermally conductive material at room temperature, far surpassing the thermal conductivity of copper. With this new offering, we’re continuing to build our extensive portfolio of thermal grade materials to meet the needs of those in the microelectronics and electronics packaging industry. We’re committed to providing a full range of options and specifications to effectively address thermal management challenges, including specific requirements for surface flatness, low roughness and metallization.”

CVD diamond is uniquely suited for advanced thermal management in applications such as advanced packaging, due to its exceptional combination of properties including high thermal conductivity, mechanical strength, electrical insulation, low weight and chemical inertness. In this role, CVD diamond enables system size reductions, improved reliability and the opportunity to design higher power systems within an existing module footprint.

With a focus on customizability,our solid thermal products are available up to one millimeters thick and in diameters up to 3inch diamond heat sink   can be laser cut to any required size. Furthermore, metallization solutions enable die bonding with low thermal barrier resistance, consistent with industry standard soldering and brazing.