Diamond wafer helps high-power LED solve heat dissipation problems

With the use of large-scale matrix type LED lights, energy consumption will also become increasingly high. If the heat dissipation problem is not dealt with in a timely manner, it will lead to heat concentration in the PN junction of the diode, which will reduce the service life of LED lights and even burn out the LED in severe cases. LED is a high-temperature sensitive component. If its heat generation is large and the temperature is too high, it will directly affect the lighting effect, color temperature, and even have a serious impact on its normal use. It is urgent to strengthen the issue of high-power LED heat dissipation.

The power density of the active area of ultra-high power LED is extremely high, reaching 1kW/cm2 or even higher. The commonly used substrates for traditional epitaxial layers are sapphire, silicon carbide, and silicon, with thermal conductivity ranging from 25-400W/(m · K). Even with the use of silicon carbide substrates, it can only be below 200W/cm2, and heat dissipation has become the biggest technical bottleneck for the development of ultra-high power LED devices. Diamond heat sink sheets have a thermal conductivity of 2000W/(m · K), which can reduce device thermal resistance and improve power density, making them an excellent material for manufacturing high-power LEDs. If diamond wafers are used as heat dissipation materials, it will significantly improve the luminous efficiency and service life of LEDs.

Diamond heat sink sheets have high bandgap, breakdown field strength, high thermal conductivity, low dielectric constant, and high carrier saturation rate. A comprehensive evaluation of the service life and luminous power of LED lamps made of different materials shows that diamond is not only superior to conventional semiconductors such as Si and GaAs, but also several times higher than its competitor 6H SiC.

Using diamond heat sinks as heat sinks for high-power LEDs can effectively reduce the operating temperature of LEDs. At the same preparation cost, increasing the growth rate of diamond films can more effectively improve the heat dissipation effect than improving the quality of diamond films. Diamond has a very high thermal conductivity, so the heat generated by LED tubes is quickly transferred to the diamond, keeping the LED at a lower normal operating temperature.

CSMH focuses on the production and preparation of high-quality diamonds, using the most advanced MPCVD device to prepare high-quality large-sized diamond films. The core products include diamond wafer, diamond heat sink, diamond window, diamond based heterojunction integrated composite substrate, and AlN film, with product quality reaching the world's leading level. The thermal conductivity of diamond heat sinks reaches 1000-2000W/m.k, which will help high-power LEDs easily solve the heat dissipation problem.