Due to its excellent properties such as high thermal conductivity, high temperature resistance, corrosion resistance, and radiation resistance, diamond has important application prospects in fields such as high-frequency and high-power microelectronics.
However, there are still many problems in applying high thermal conductivity diamond to the field of electronic packaging: due to its high hardness, difficulty in processing, susceptibility to substrate roughness and deformation, as well as the difficulty of effectively wetting the diamond surface with most metals or alloys, and the difficulty in volatilizing organic matter during sintering and burning out adhesive molecules in interface molecules. Therefore, high-quality, high surface precision, and low roughness diamond films are very important.
After metallizing the surfaces of diamond and silicon, double-sided printing technology was used to coat silver adhesive, and pre drying at 160 ℃ was controlled before applying low pressure to maintain adhesion for 30 minutes. Then, sintering was carried out at 200 ℃ to achieve a good bonding effect between large-sized chips and high thermal conductivity diamond (10 × 10 mm), with no obvious defects in the entire bonding layer. On the basis of this method, the development of high thermal conductivity diamond heat dissipation applications can be improved, which is expected to solve the current problems of high heat generation and difficult heat dissipation in high-power chips and modules.
CSMH is a semiconductor technology company that focuses on the production and research and development of diamond materials. Its core products include diamond wafers, diamond heat sinks, diamond optical windows, diamond heterojunction integrated composite substrates, etc. High power semiconductor lasers using diamond heat sinks have been used in optical communication and have also been applied in fields such as laser diodes, power transistors, and electronic packaging materials.
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