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Home KnowledgeTechnologyDiamond wafer: The "king" in the field of heat dissipation

Diamond wafer: The "king" in the field of heat dissipation

Date:2024-03-06Hits:85

Diamond is not only the king of gemstones, but also the king of heat dissipation. Due to its excellent thermal conductivity, it can quickly transfer heat from the heat source to the cooling system, effectively reducing the temperature of the equipment. This makes diamond an ideal heat dissipation material, which can not only help solve heat dissipation problems in fields such as 5G RF chips, millimeter wave antennas, wireless charging, wireless transmission, IGBT, printed circuit boards, AI, and the Internet of Things. It can also improve the processing speed of chips, bringing potential to fields such as high-performance computing and electric vehicles.

 

According to statistics, electronic component failures caused by heat concentration account for 55% of the total failure rate, and product heat dissipation design has a crucial impact on product reliability. Semiconductor lasers have small size and long lifespan, and can also be applied in radar, sound measurement, and medical fields in addition to communication. However, research has found that heat dissipation affects the lifespan and usage of semiconductor lasers. Excessive CPU temperature can cause the computer to automatically shut down, blue screen, crash, and lag. Prolonged high temperature can affect its lifespan. Both high-power devices and power electronics are extremely important for thermal management.

 

Diamond has many excellent properties. It has a wide bandgap, high thermal conductivity, high breakdown field strength, high carrier mobility, high temperature resistance, acid and alkali resistance, corrosion resistance, and radiation resistance. Its superior performance makes it play an important role in high-power, high-frequency, and high-temperature fields. The most prominent feature is that diamond has a high thermal conductivity, and at 30-650 ℃, diamond is the crystal with the highest thermal conductivity among solid materials. The thermal conductivity of a crystal is determined by its heat capacity, average free path of phonons, and phonon velocity. The diamond lattice exhibits weak anharmonic vibrations, while the average free path of phonons is longer; Debye has a high temperature and fast phonon velocity, resulting in extremely high thermal conductivity. At room temperature, the thermal conductivity of diamond is 5 times that of copper and 15 times that of silicon, giving it a significant advantage over other substances.


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CSMH focuses on the research and production of diamond, and the diamond production technology and quality have reached the international leading level. Through independent innovation and customized product research and development, we have comprehensively mastered the three core processes of diamond growth, processing, and metallization: wafer grade diamond, optical grade diamond, polycrystalline diamond heat sink, bonding grade diamond, diamond based aluminum nitride, silicon based aluminum nitride, and sapphire based aluminum nitride


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