Diamond wafer Increase Performance, Efficiency, and Device Lifetime

CVD diamond translates a competitive advantage in electronic thermal control where power, temperature, and reliability are essential factors.

By utilizing synthetic diamond’s unparalleled thermal performance, semiconductor design engineers can discuss today’s significant challenges, like increased reliability and increasing energy density on a smaller footprint, providing both device and system manufacturers with a world-leading competitive edge.

CVD diamond is the ideal heat spreader for device and package designers as it combines low weight, electrical insulation, mechanical strength, low toxicity, and low dielectric constant with a room-temperature thermal conductivity that is up to five times greater than copper.

We develops diamond characteristics to match its clients’ unique performance/cost needs and customized cuts, metalizing diamonds to help customers integrate singulated heat spreaders into their modules and systems.

CVD diamond enables dramatic increases in lifespan and power for the latest semiconductor GaN devices while lowering operational costs.

Heat is the single most common cause of electronic failure. Theoretically, lowering the operating junction temperature by 10° C can quadruple the life of a gadget. CVD diamond beats today’s standard thermal management materials, like copper, silicon carbide, and aluminum nitride, by orders of magnitude.

CSMH's high-quality diamond wafers, diamond heat sinks, diamond windows and other products are currently used in High-Power RF devices, High-brightness LEDs, Energy distribution, Die-attachment processes, etc.