Diamond is known to be an extremely hard material that’s excellent for cutting tools. Less well known is the fact that it’s also an excellent thermal conductor—up to five times better than copper and 10 times better than other commonly used ceramic heat spreaders. In addition, it has mechanical and electrical properties that make it a strong candidate for heat spreaders for high-power, high-density circuits and devices, such as gallium-nitride (GaN) discrete transistors, monolithic-microwave integrated circuits (MMICs), and laser diodes.
CSMH has developed a process using chemical vapor deposition (CVD) by which thin diamond films can be synthesized under tightly controlled conditions . This results in CVD polycrystalline diamond with high consistency and repeatability, ideal for heat spreaders with the extremely low thermal resistance and isotropic behavior needed to “get the heat out.”
Diamond is a low-density material with high mechanical strength that has a low dielectric constant and is intrinsically a good electrical insulator. It is unparalleled as a thermal conductor, with the low thermal resistance and isotropic behavior that enables heat to flow freely through the material in all directions.
CSMH has engineered the material in many forms, in thicknesses from 100 to 2,000 µm and wafer diameters to 140 mm for mechanical and electrical products. In addition to its CVD growth process, the firm developed laser-cutting and polishing methods for achieving low surface roughness that have the high flatness required to achieve gap-free interfaces with semiconductor substrates and other packaging materials.
For heat-spreader applications, the company offers with four grades of thermal conductivity: TC1200, TC1500, TC1800, and TC2000. As a heat spreader for high-power packages, all four grades offer considerably higher thermal conductivity than commonly used high-power package materials, including copper (Cu), beryllium oxide (BeO), and aluminum nitride (AlN).
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