Diamond wafer tablets which is good, CSMH to give you the answer!

In the continuous exploration of the choice of device heat dissipation material, we understand that the core index is the surface roughness of the growth surface and its thermal conductivity.

The first is the surface roughness of the growth surface of the diamond thermoset. As an electronic component, diamond requires extremely low surface roughness and extremely high surface shape accuracy, thereby increasing the contact area and improving its heat dissipation efficiency. At present, the surface roughness of diamond thermal sedimentation tablets is mostly tens of nanometers to hundreds of nanometers, and the chemical accumulation electricity leads the surface roughness of the growth surface of diamond thermal sedimentation tablets to break through to less than 1nm, which fully meets the requirements of diamond as an electronic component.

Ra is defined as the mean arithmetic deviation (mean roughness) of the curve, Rz is defined as the average height of unevenness, and Ry is defined as the maximum height. The maximum height difference for microscopic profiles Ry is also expressed using Rmax in other standards.

Table 1 Ra,Rmax parameter comparison (um)

The second is thermal conductivity. The thermal conductivity of diamond wafer tablets reaches 1000-2000W/m.K. As a heat sink, diamond exhibits excellent heat dissipation characteristics: on the one hand, the heat concentrated in the PN junction of the device can be evenly and rapidly diffused along the heat sinking surface; On the other hand, the heat is quickly exported along the vertical direction of heat sinking.

Figure 1 Comparison of the thermal conductivity of diamond with other heat dissipation materials

CSMH is a high-tech enterprise focusing on the research and development and production of third-generation (wide bandgap band) semiconductor substrate materials and devices, and is committed to becoming the world's leading wide bandgap semiconductor materials and devices company. We have always adhered to the concept of customer first, to provide customers with the best products and services. At present, the company has realized the large-scale production of diamond and aluminum nitride related products, the existing diamond wafer Ra<1nm, diamond thermal imposition sheet thermal conductivity 1000-2000W/m.k, and GaN on diamond, Diamond on GaN, diamond-based aluminum nitride and other products. And has been widely used in 5G base stations, lasers, new energy vehicles, new energy photovoltaics and other fields.Here, we will provide you with the most comprehensive diamond thermal management program.