Diamond heat sink can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually all measures of semiconductor performance. The ability of diamond to insulate high voltages across much thinner layers of material enables diamond to be used in lightweight applications.
Diamond heat sink offers to the cost/performance requirement of our customers:
1000-2000 w/mK for the most difficult heat problems
We can make spreaders with Metallization
We can offer heat spreaders with the following characteristics:
Range of thicknesses available: up to 1mm thick
Ra:＜1nm
Very flat and low roughness ensuring ease of attachment and minimized thermal interface resistances
Diamond is grown on 2” wafers that can be laser cut to any required size
Flat, smooth diamond with Metallization solutions enabling die bonding, standard soldering and brazing
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