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Home KnowledgeTechnologyDiamond wafer: A Future Material from Synthesis to Application

Diamond wafer: A Future Material from Synthesis to Application

Date:2025-08-21Hits:27

Diamond, known as the "king of materials" for its excellent mechanical, electrical, thermal and optical properties, has shown broad development prospects in many fields. From synthesis technology to practical applications, the research and development of diamond is constantly promoting the advancement of science and technology.

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Mechanical properties:Its extremely high hardness and wear resistance make it an ideal material for cutting tools and wear-resistant coatings.

 

Electrical properties:High thermal conductivity and excellent electrical insulation make it important for applications in electronic devices and heat dissipation materials.

 

Thermal properties:Its extremely high thermal conductivity makes it an ideal heat dissipation material, especially for high-power electronic devices.

 

Optical performance:Its high refractive index and wide spectral transmittance give it unique advantages in optical windows and laser devices.

 

Diamond's high thermal conductivity and electrical insulation help electronic devices, and its high refractive index and wide spectral transmittance are beneficial to optical applications. As a semiconductor substrate, it has outstanding performance.Diamond has excellent performance, and technological progress will promote its commercial application in many fields.

 

CSMH uses the MPCVD method to prepare large-sized and high-quality diamonds,and currently has mature products such as diamond heat sinks, diamond wafers, diamond windows,diamond hetero junction integrated composite substrates,etc.Among them,the thermal conductivity of diamond heat sinks is 1000-2200w/(m.k), and the surface roughness of diamond wafer a<1nm.It has been applied in aerospace, high-power semiconductor lasers, optical communication, chip heat dissipation, nuclear fusion and other fields.

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